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Typical mechanical tests used to determine the mechanical properties of components and joints in microelectronic devices are:
- Die Shear
- Stud Pull
- Lead Pull
- Tensile/Creep/Fatigue
- Lap Shear
- Center Cracked Beam
- Single Edged Notch
- End Notched Flexure
- Ball Shear
- Peel
 Select image to enlargeDie Shear Testing
Packaging design uses epoxy adhesive to bond the silicon die to the device substrate. Die Shear
testing is used to determine the bond strength between the die and the substrate. The die shear
strength is defined as the maximum force required to break the epoxy bond.
A complete die shear system consists of:
- A clamping fixture.
- A shear tool with force measurement system.
- Positioning devices to allow for adjustment of the specimen
relative to the shear tool.
High load frame stiffness and accurate control are required to ensure repeatable tests, and the Instron MicroTester is specially
designed for performing such tests. Applicable standards include SEMI G63-95 and MIL-STD-883C Method 2019.5.
Occasionally, the interfacial bond strength is higher than the intrinsic die strength, resulting in die breakage under test.
Die breakage can be minimized by performing the test at elevated temperature, or by using a stud pull test as an alternative.
 Select image to enlarge
Indentation Testing
Properties of micro volume & thin films are normally different from bulk material. Due to the
size of specimen, conventional testing techniques do not offer a practical solution.
Indentation testing can be used for testing of materials to determine a wide range of material
properties, often in a nondestructive manner. Elastic properties such as modulus can be derived from
indentation testing to provide micro volume material characterization.
Load and indentation depths are measured for both loading and unloading to derive elastic
properties of the material. In addition, it is necessary to be able to accurately position the test
specimen under the indenter probe. The Instron MicroTester is designed with powerful data acquisition
and high displacement resolution to effectively perform such tests and is complemented by a family
of indenter accessories.
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