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Designed specifically to meet the requirements
of designers and engineers involved in microelectronics packaging
development and qualification. Configured for use with our range of
load frames, dedicated instruments, or flexible test systems.
- Specialist Fixtures
- Grips
- Clamping Stages
- Peel Fixtures
- Rotation Stages
- Heating Stages
- Environmental Chambers
- Flexure Fixtures
Read on to learn more about a selection from our range of microelectronics
testing
fixtures.
Die Shear System
The die shear device allows for accurate and repeatable
determination of the interfacial bond strength between die and substrate.
A novel solution can be provided to compensate for variations in
epoxy thickness giving repeatable lift off distance. The system
features self-aligning clamping devices to securely hold the die
specimen. When used in conjunction with the Instron MicroTester
system, stiffness and rigidity is kept at a maximum to ensure reliable
result determination.
Lead Pull System
A range of specialist gripping devices are provided
for secure gripping during wire and lead pull testing. The gripping
faces are specially designed to allow gripping of small wires. The
actuator of the grip body remains behind the grip face, to
allow gripping of components in confined or restricted spaces. The
Instron MicroTester system allows precise positioning of the grip
face resulting in secure gripping.
Stud Pull
Where die shear testing is unsuitable, stud pull
may be used as an alternative. A critical factor during stud pull
testing is alignment accuracy during specimen preparation. For this
purpose, an alignment jig is provided with the stud pull fixture
to allow secure bonding and repeatable alignment. In conjunction
with the MicroTester systems' special interface design, complete
system alignment is assured.
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