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Posted On Feb 03, 2020

Audit Trail in Bluehill Universal Traceability Module

Traceability Webinar + Q&A

In this webinar, Instron introduces Bluehill Universal's latest Module called Traceability. Bluehill Traceability enables users to meet the requirements of audits associated with FDA 21 CFR Part 11, ISO 17025, NADCAP, and others, allowing users to determine who did what, when, and why. The webinar includes a presentation and live software demonstration, as well as provide attendees with resources that include technical specifications.

Posted On Jan 17, 2019

bluehill universal touchscreen interface

Biaxial Testing of Medical Devices

An aging population is increasing the demand for common medical consumables like syringes and medicine bottles. As this demand increases, so does the need to test these products to ensure they comply with relevant international standards – some of which require biaxial testing.

Posted On May 07, 2018

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Why 2018 Is the Year to Buy Capital Equipment

In early 2018, the United States Congress passed the first major tax reform since 1986, reducing the corporate tax rate from 35% to 21%. Find out why this is good news for businesses looking to purchase capital equipment this year.

Posted On May 04, 2018

AT3 Film Testing

Video | AT3 Automated Film Tensile Testing to ASTM D882

Watch this new video to see how the versatile TestMaster AT3 Automated Testing System makes it easy to run tensile tests on thin films, improving repeatability, safety, and efficiency.

Posted On Mar 29, 2018

Why this lab breaks things

This Lab is in the Business of Breaking Things

Have you ever wondered how strong those straps are that hold down loads on tractor-trailers?

Posted On Mar 26, 2018

Ghent University

Biomedical Case Study | Ghent University

Learn about the multiple ways to use an Instron® system for medical device testing in this interview with Dr. Matthieu De Beule, Biomedical Research Professor at Ghent University.

Posted By Elena Mangano

 Jan 16, 2018

BluehillUniversal OperatorDashboard BendTesting

Bluehill® Universal Software: Top 5 FAQs

While maintaining all of the power and flexibility found in previous versions of Bluehill Software, our newest static testing software, Bluehill Universal was built from the ground up for touch interaction and boasts many advanced capabilities. With anything new, people have questions. Here are the top 5 we get, that you might also wonder!

Posted On Jun 08, 2017

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How Quick is a "QuickTest"?

As a standard feature with the new Bluehill® Universal Software, QuickTest allows operators to start testing after merely entering basic parameters in a few seconds.

Posted By Ian Kirk

 May 24, 2017

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When You Don’t Take Advantage of Software Updates

As anyone with a smartphone is aware, software developers are constantly improving their software with periodic updates for a variety of reasons. Major phone companies release updates at least once a year, and in between the major updates, they push out smaller bug fixes and patches as flaws are inevitably found in the program, application, or operating system. This same idea applies with Bluehill® Software.

Posted On Apr 13, 2017

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What Does "Touch-friendly" Software Actually Mean?

The progressive outcome of Bluehill® Universal took a consolidated effort from Instron experts, bringing together unrivaled experience and cutting-edge research. The user experience has been designed by a collaboration of members from different software teams across the world, each team representing various software products offered by Instron. This consortium has worked closely together to create a Bluehill application style that can be translated across all of Instron’s software products.

Posted By Rajiv Iyer

 Apr 03, 2017

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Micro Three-Point Bend Testing for Microelectronics

Reliability analysis of electronic packages and components is a critical step in microelectronics, as these packages are widely used in portable devices such as smartphones, tablets, laptops, etc. Studying electrical performance may not be enough, as a package’s mechanical characterization can directly or indirectly impact reliability of a finished product. Three-point bend tests are performed to understand the strength of chip packages, such as chip-on-film (COF), integrated circuits (IC), and ball grid arrays (BGAs).