AEC-Q200-005-REV (A) defines the standard for verifying the bond strength of surface mount components on finished printed circuit boards (PCBs) to understand their ability to withstand bending, flexing, and pulling forces. Electronics assembly manufacturers for automotive OEMs are interested in learning and characterizing bond strength for adhesives that are used to mount and hold the surface mount components and their leads in place on a PCB.
The standard requires that the finished PCB be held in position upside down on the lower anvils, and for a force to be applied on the target location using an upper anvil. This bending force needs to be applied for 60 seconds (+5 seconds) until a bending deflection of at least 2 mm is achieved. Once the test is completed, a thorough visual inspection must be performed on the flexed component.