MIL-STD-883 Department of Defense Test Method Standard for Microcircuits

MIL-STD-883: Department of Defense Test Method Standard for Microcircuits

MIL STD 883 testing solutions

MIL-STD-883 is a test method used in the semiconductor and microelectronics industry to determine the integrity of the connection between a semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on the measurement of adhesion force between the die/package and the substrate, and is useful for testing microelectronic components or electronic packages such as IC chips, BGA, QFN, CSPs, and Flip Chips. MIL STD 883 is an ideal method for measuring the shear force required to to initiate failure of glue, solder, and sintered silver bonded areas.

 

Materials Testing Equipment

For die shear testing we recommend an Instron 6800 Series single or dual column system with Bluehill Universal software. 6800 Series systems are recommended due to their high crosshead displacement accuracy.




MIL STD 883 Test Setup
6800 Series Universal Testing System
Shear tool head fixture (CP124648)
Microscope holder
90° plate and clamp to hold specimen
x y theta stage to position specimen

 

MIL STD 883
Test Fixtures and Accessories

Instron Die/package shear test fixtures are designed for accurate shear force measurement in accordance with MIL STD 883 Test Method 2019. They consists of a specially designed shear tool head fixture (CP124648), a general 90-degree angle plate and clamp S4781A for shear testing specimen installation, and an x-y-theta stage (CP127130 - 5kN or S4752A - 1kN).

Using the x-y-theta stage CP127130 or S4752A, user can accurately adjust and align the position and angle of the die/package edge with respect to the edge of the shear tool. The angle plate and clamp fixture S4781A has a theta stage that can self-align the shear tool’s front face with the face of the die contact edge to ensure that the shear force is applied uniformly. The shear tool head fixture has a built-in touch sensor that enables it to precisely detect the point of contact between the shear tool and the substrate surface. This allows for accurate positioning of the shear tool above the substrate. The shear tool is interchangeable for different shear tool widths, and elevated temperature shear testing can also be performed by adding a hot stage (CP127131 or S4761A). In general, bond adhesion degrades with increased temperature, so it is essential to qualify bond strength as a function of temperature. 




MIL STD 883 Fixtures
Theta x-y stage
Shear fixture
Shear tool wedge

 

MIL STD 883 fixtures
Tips and Tricks

The biggest challenge in MIL STD 883 testing is to ensure that the shear head applies a uniform force distribution to an edge face of the die and to ensure that the die contact tool is perpendicular to the die mounting plane of the header or substrate. This can be even more critical when testing a die that is large or thin; as the die becomes larger and thinner, the relative size of the die-shear tool contact area against the bonding area will decrease, which can result in the stresses created by the shear tool being higher than the yield strength of the die. This will cause it to splinter or shatter before the bond is tested. Instron’s fixturing for testing to MIL STD 883 incorporates a design able to help overcome this challenge while also allowing for temperature testing. To read this standard in full, purchase MIL-STD-883.

Related Content

6800 시리즈 프리미어 시험기 브로셔

Instron 6800 시리즈 만능 시험기는 최고의 정확도와 신뢰성을 제공합니다. 6800 시리즈는 완전히 새로운 Smart-Close Air Kit 및 Collision Mitigation 기능이 있는 특허 출원 중인 Operator Protect 시스템 아키텍처를 기반으로 하며, 그 어느 때보다 간편하고 스마트하며 안전한 소재 시험을 가능하게 합니다.

Bluehill Universal 브로셔

Bluehill Universal 소프트웨어는 터치 상호작용과 직관적인 사용자 경험을 위해 처음부터 새로 구축되었습니다. 사전 로드된 시험 방법, 몇 초 만에 진행되는 QuickTest, 향상된 데이터 내보내기 및 서비스에 대한 직접 통신 링크를 제공하는 신규 기능인 Instron Connect와 같은 기능으로 더 간단하고 스마트한 시험을 확인해보십시오. Bluehill 2 및 Bluehill 3와 같은 이전 버전의 소프트웨어 사용자는 Bluehill의 최신 버전으로 쉽게 업그레이드할 수 있습니다.