문헌
브로셔,매뉴얼,백서 및 사례 연구를 위한 문헌 라이브러리
MicroImpact White Paper
White paper discussing fundamental theories of board level drop impact testing and a study of the fracture characteristics of solder interconnections under high-speed impact using Instron’s new Micro Impact tester.
Whitepapers 05/19/2005 442.92 KB
New Development in Testing for Microelectronics
A review of developments in testing technology in the context of fracture test methodologies proposed and underdevelopment for measurement of interfacial properties.
Whitepapers 04/29/2005 456.35 KB
Micromechanical Testing in Microelectronics
A detailed knowledge of the mechanical properties is required in order to ensure good process yields and reliable products.
Whitepapers 02/28/2005 97.55 KB
Effects of Temp. Changes on Elastomer Seals
Article from: Elastomer Seal Performance, January 2002.
Whitepapers 02/21/2005 124.65 KB
Interfacial Cracking in Microelectronic Packaging
New techniques based on Fracture Mechanics principles for properties in mode I, II and mixed mode fracture offer the ability to determine the fundamental materials and interfacial properties needed to properly model package designs.
Whitepapers 12/08/2004 2.04 MB