The Challenge
Die shear testing is an important step when investigating the mechanical reliability of conductive adhesives that are used between the die and substrate. When designing modern surface mount assemblies, manufacturers are constantly formulating novel isotropic conductive adhesives that can improve the shear strength over traditional adhesives. Additionally, experts are interested in understanding the failure analysis post-shearing of the die. As the high density packaging and component miniaturization trends continue to grow, electronic packages are getting smaller and thinner in size. As a result, it is critical to understand the mechanical performance of these components.
