Die Shear Testing of Electronic Packages
IPC TM-650 | MIL-STD-883E | AEC-Q200-006A | ASTM F1269-13
The Challenge
Die shear testing is a critical step in evaluating the mechanical reliability of conductive adhesives used between the die and substrate in electronic packages. As manufacturers develop novel isotropic conductive adhesive formulations to improve shear strength over traditional materials, die shear testing provides the quantitative data needed to compare formulations, validate new designs, and understand the failure modes that occur at the adhesive interface.
The challenge of die shear testing is compounded by the ongoing trend toward smaller and thinner electronic packages. As component dimensions continue to shrink, the precision required to accurately position the shear probe on increasingly miniaturized target components increases — and the forces involved in shear testing become correspondingly smaller, placing greater demands on load measurement accuracy and fixture design. Post-shear failure analysis is also an important part of the evaluation process, requiring clear visual documentation of the failure mode at the die-substrate interface.
Our Solution
Testing System - Die shear testing can be performed on an Instron 6800 Series single or dual column table model system, providing the low-force measurement capability and precision crosshead control needed for accurate die shear testing of miniaturized components.
Software - Bluehill® Universal software is used to create and run die shear test methods, with results including maximum shear force and force-displacement curves available for analysis and reporting. Test methods can be saved and reused across multiple specimens for consistent, repeatable testing programs.
TestCam Video Integration - For visual documentation of the die shearing process and post-shear failure mode, TestCam(opens in new tab) captures high-frame-rate video synchronized with the force-displacement data in Bluehill Universal. This allows engineers to observe exactly how and where failure initiates at the die-substrate interface — supporting detailed failure analysis alongside the quantitative test results.
Terminal Strength Shear Fixture - Instron's Terminal Strength Shear Fixture (CP122690)(opens in new tab), developed by our Custom Solutions Group, is designed specifically for die shear and terminal strength testing of surface mounted components on populated PCBs. The fixture consists of two key elements:
- Adjustable PCB holder — accommodates a variety of board sizes, securing the PCB firmly in position during testing to prevent movement that could affect result accuracy
- Linear rail with probe positioning — allows the operator to center the shear probe precisely on the target component, ensuring the shear force is applied correctly regardless of component location on the board
A variety of probe sizes are available to suit components of different dimensions, allowing the fixture to be used across a wide range of package types and sizes.
Talk to an Instron Expert.
Whether you are developing a new die shear test program or looking to improve the accuracy and failure analysis capability of an existing one, our team can help you identify the right fixture, probe configuration, and system setup for your components and standards.
Contact Our Sales Department.
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