As electronic components become smaller, more complex, and more densely packaged, the mechanical reliability of interconnections, substrates, and assemblies becomes increasingly critical. Instron provides a comprehensive range of testing solutions for microelectronics manufacturers and reliability engineers — covering the full spectrum of mechanical tests required to evaluate electronic packages, printed circuit boards, IC components, and flexible circuits. Browse the applications below to find the right approach for your testing requirements.
Evaluate the mechanical robustness of electronic packages under bending loads — identifying failure modes in solder joints, substrates, and component interconnections to IPC and JEDEC standards.
Assess the structural integrity of PCBs under bending conditions to simulate real-world handling, assembly, and drop events — supporting reliability testing to IPC TM-650 and JEDEC standards.
Measure the compressive strength and deformation behavior of IC packages and electronic components to evaluate mechanical robustness during handling, assembly, and in-service loading.
Evaluate the bond strength of dies attached to substrates or lead frames by measuring the force required to shear the die from its mounting surface — a critical test for adhesive and solder die attach reliability.
Measure the tensile bond strength of lead frames and wire bonds at the solder joint to evaluate interconnection reliability and compare the performance of different bonding materials and processes.
Characterize the mechanical behavior of individual solder balls under compressive loading — providing critical data for BGA and CSP package reliability assessment and solder material development.
Evaluate the adhesive bond strength between electronic components and substrates by measuring the tensile force required to pull a stud or component from its bonded surface.
Measure the tensile strength, elongation, and modulus of copper clad laminates used as PCB substrate materials — supporting material qualification and quality control to IPC and ASTM standards.
Evaluate the torsional stiffness, strength, and durability of flexible printed circuits and microelectronic components under rotational loading — critical for applications involving repeated flexing or twisting in service.
Talk to an Instron Expert.
Whether you are developing a new test program for microelectronics reliability or looking to improve the accuracy and repeatability of an existing one, our team can help you identify the right testing solution for your components, standards, and throughput requirements.
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