Lead Frame and Wire Bond Pull Test
IPC TM-650 | ASTM F459-13
The Challenge
Lead frames provide the electrical interconnection between the die and the substrate in a wide range of electronic packages — including capacitors, resistors, and integrated circuit (IC) chips. Simple components may have one or two leads, while complex IC packages can have hundreds. These lead frames are bonded using solder paste materials, and evaluating the strength of those bonds is a critical part of reliability testing.
Tensile pull testing reveals where failure occurs at the solder joint and helps engineers compare the performance of different lead frame materials — such as gold and copper — during new product development and final assembly qualification. Common challenges in lead frame pull testing include accurate gripping of fine-pitch leads, precise alignment of packages and components, secure mounting of printed circuit boards (PCBs), and identifying the exact point of failure in real time.
Our Solution
Micro Pneumatic Grips - Instron's micro pneumatic grips are specifically designed for lead frame pull testing, holding leads in a precise, repeatable position for accurate tensile testing. The pneumatic actuation ensures consistent clamping force across every test — reducing operator variability and improving result repeatability.
XY Stages for PCB Alignment - XY stages allow rigid or flexible PCBs to be accurately mounted and positioned for testing. Micrometer adjustments in the X and Y axes, along with angular theta adjustment, enable precise alignment of fine-pitch components before gripping. XY stages are available in manual and motorized versions — the motorized version enables fully automated lead pull testing for high-throughput applications requiring maximum accuracy and repeatability.
TestCam Video Module - The TestCam module for Bluehill® Universal captures high-frame-rate video synchronized with test data, allowing operators to review images and video at specific test points in real time. This makes it straightforward to visually confirm failure location and mode alongside the force-displacement data.
Bluehill® Universal Software - Bluehill Universal provides the calculation tools and graphing capabilities needed for lead frame pull testing — including force vs. displacement plots that identify the maximum load required to break the lead from the solder joint. Custom calculations and response curves can be added to suit specific testing requirements and reporting formats.
Talk to an Instron Expert.
Whether you are setting up a new lead frame pull test program or looking to improve the accuracy and throughput of an existing one, our team can help you identify the right grips, fixtures, and system configuration for your application.
Contact Our Sales Department.
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