Compression Testing of IC Packages
The Challenge
Three closely related trends in the microelectronics industry — complex PCB layouts, dimensional reduction of packages, and increasingly high-density component mounting — are driving the need for more precise mechanical characterization of integrated circuits and electronic packages.
The assembly of ICs and other components on both sides of a PCB introduces mechanical stress that increases the probability of cracks and fractures, particularly as component density grows. At the same time, OEMs need to understand not just the mechanical behavior of these packages under compressive load, but also how the application of force affects the electrical output — such as voltage and current — of the chips themselves. As materials and package geometries continue to evolve, these combined mechanical and electrical characterization requirements are becoming increasingly important in both development and quality control programs.
Our Solution
Multi-Point Compression with Automated XY Stage - Instron's 6800 Series single and dual column systems, configured with an Automated XY Stage, enable micro-compression testing across multiple points of a chip or component in a single automated sequence. Custom fixtures developed by Instron's Custom Solutions Group clamp components in the correct position for accurate, repeatable testing, and a range of probe styles are available — or can be developed — for point-based compression testing of specific component geometries.
System Compliance Correction - Because micro-compression tests measure displacement or deflection in microns, even small contributions from machine, load cell, and fixture compliance can affect result accuracy. Compliance correction routines can be performed to remove these contributions from the measured displacement — ensuring that reported deflection values accurately reflect specimen behavior rather than system characteristics.
Whole-Package Compression - Micro-compression platens are available for compressing the entire package or chip simultaneously, enabling characterization of the overall compressive stiffness and strength of the package as a unit.
Displacement Measurement Options - Two displacement measurement approaches are available depending on the application requirements:
- Contact measurement — the LVDT Platen Displacement Fixture provides direct contact-based deflection measurement for applications where physical contact with the specimen is acceptable
- Non-contact measurement — the AVE3 Advanced Video Extensometer provides non-contact deflection measurement in microns for sensitive specimens where contact could affect results
Bluehill® Universal Software with Electrical Channel Integration - Bluehill® Universal software is used to set up and run test methods for both XY stage multi-point testing and whole-package platen compression. External strain channels can be used to capture electrical measurements — such as voltage and resistance — alongside mechanical force data, with graphical results displaying the relationship between applied force and electrical output directly in the software.
Talk to an Instron Expert.
Whether you are developing a new compression test program for IC packages or need help configuring a multi-point automated testing solution, our team can help you identify the right setup for your components and measurement requirements.
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