Stud Pull Test for Electronic Packages
The Challenge
Surface mount assembly involves bonding electronic packages to a printed circuit board using solder paste and adhesive materials. For packages such as flip chips, ball grid arrays (BGA), and chip-scale packages (CSP), underfill adhesives are applied between the die and the substrate to reinforce the bond and protect the interconnections from mechanical and thermal stress.
As part of design validation and reliability testing, OEMs need to measure the tensile bond strength of these adhesives under a range of operating conditions — including elevated temperatures that reflect real-world service environments. Accurate stud pull testing requires precise specimen preparation and careful alignment of the stud perpendicular to the substrate, as any misalignment introduces bending moments that can affect results and lead to premature or off-axis failure.
Our Solution
Specimen Preparation Fixture - Accurate stud pull testing begins with correct specimen preparation. Instron's specimen preparation fixture allows the operator to bond studs onto the die package using a high-strength adhesive under a controlled, constant applied force. This ensures correct alignment of the stud perpendicular to the package surface during bonding — a critical factor in producing accurate and repeatable pull test results.
Stud Pull Fixture - The stud pull fixture(opens in new tab) features upper and lower fittings with self-aligning swivels at both ends, allowing the stud to align accurately parallel to the frame and perpendicular to the crosshead during the pull test. This self-aligning design compensates for minor misalignments between the stud and the load string, ensuring that the applied force is purely tensile and that results accurately reflect the bond strength of the adhesive rather than the effects of bending or off-axis loading.
Stud Sets - Stud sets are available in a range of sizes from 2 mm to 50 mm to accommodate the full range of die package dimensions — from miniaturized CSP components through to larger BGA packages.
High-Temperature Testing - High-temperature environmental chambers are available for performing stud pull tests at elevated temperatures, allowing engineers to evaluate adhesive bond strength under conditions that reflect real-world operating environments and thermal stress scenarios.
Software - Bluehill® Universal software is used to set up and run stud pull test methods, with results including maximum tensile force and force-displacement curves available for analysis and compliance reporting.
Talk to an Instron Expert.
Whether you are setting up a new stud pull test program or need help selecting the right stud size and fixture configuration for your package assemblies, our team is ready to help.
Contact Our Sales Department.
Please complete the form below and we will be happy to contact you with a response. Our typical response time for an online request is within 1-2 business days. For a faster response, please call +1-800-473-7838.
