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Solder Ball Compression Test

IPC TM-650

The Challenge

Solder paste manufacturers and electronics packaging engineers are continuously developing new solder alloy and flux compositions to address the challenges of assembling increasingly miniaturized components. Type 6 solder powder — with a particle size of 10 µm and below — is preferred over Type 4 and Type 5 pastes for assembling 0201 chip components, and ball grid array (BGA) packages are trending toward progressively smaller solder bump sizes.

As solder bumps shrink, understanding their mechanical performance becomes increasingly critical. The compressive strength of an individual solder ball — the maximum load it can sustain before cracking to failure — is a key parameter for characterizing bump strength, validating new solder formulations, and ensuring the mechanical reliability of package assemblies in service.

Our Solution

Testing System - Instron's 6800 Series systems are well suited for micro-precision solder ball compression testing. Single column systems are appropriate for lower force applications, while dual column systems are available for higher force requirements. The 3400 Series is also a suitable option depending on force range and laboratory requirements.

Custom Pin Type Probes - Custom pin type probes of various dimensions are available to perform accurate compression tests on individual solder balls — ensuring the probe contacts only the target solder ball without disturbing adjacent components or altering the failure mode.

Clamping and Positioning - A range of clamping and translation stages are available for accurate positioning of package assemblies prior to testing, ensuring the probe is centered on the target solder ball for repeatable, accurate results.

Automated Multi-Ball Testing - Instron's AT2 Automated XY Stage provides a fully automated solution for performing compression tests on multiple solder balls in a single test run — improving throughput, repeatability, and consistency compared to manual single-ball testing.

High-Temperature Testing - For applications that require elevated temperature prior to compression — such as evaluating solder ball behavior under reflow-like conditions — custom heating stages are available to heat the package or substrate before the compression test is performed.

Software - The TestCam module in Bluehill® Universal software captures real-time video of the compression event synchronized with force-displacement data — allowing engineers to visually review solder ball deformation and failure mode alongside the quantitative test results for comprehensive qualitative and quantitative analysis.

Compression testing of a ball grid array IC package showing solder ball deformation during compression test

Talk to an Instron Expert.

Whether you are developing a new solder ball compression test program or looking to automate an existing one, our team can help you identify the right probe, stage, and system configuration for your package assemblies and testing requirements.