產業解決方案 » Automotive » Electronics » Bend Test on PCB

Bend Test on PCB

AEC-Q200-005-REV (A) defines the standard for verifying the bond strength of surface mount components on finished printed circuit boards (PCBs) to understand their ability to withstand bending, flexing, and pulling forces. Electronics assembly manufacturers for automotive OEMs are interested in learning and characterizing bond strength for adhesives that are used to mount and hold the surface mount components and their leads in place on a PCB.

THE CHALLENGE

The standard requires that the finished PCB be held in position upside down on the lower anvils, and for a force to be applied on the target location using an upper anvil. This bending force needs to be applied for 60 seconds (+5 seconds) until a bending deflection of at least 2 mm is achieved. Once the test is completed, a thorough visual inspection must be performed on the flexed component.

Our Solution

Instron® TestCam Video Recording and Playback module, which provides users with a video recording of how the test was conducted and how the specimen failed for post-test evaluation.

產業解決方案 » Automotive » Electronics » Bend Test on PCB

Bend Test on PCB

Automotive Testing Solutions