AI 時代下的半導體測試

隨著 AI 將半導體設計推向 3D 封裝、新材料和共同封裝光學元件 (CPO)，測試技術必須與時俱進。

落錘試驗機如何提升拉伸強度衝擊測試？

落錘拉伸衝擊測試可直接提供實驗洞見，說明材料在貼近實際的高速載荷條件下的行為表現。

如何將傳感器連接到 Instron 系統：四種方法

將第三方感測器與換能器整合至 Instron 測試系統中（無論是用於力、應變、溫度、壓力還是位移），皆需為您的配置選擇正確的連接方法。本文涵蓋了四種支援的方法：類比 0–10V 輸入、在 Bluehill Universal 中具備自動識別與自動校準功能的合理化連接、針對非 Instron 感測器的自訂多項式校準，以及透過 HBM QuantumX MX430B 等第三方設備進行的數位數據輸入。

How to Achieve More Repeatable Test Results in 3D Printing Applications

Learn how new standards combined with the latest HDT Vicat tester technology can help achieve more repeatable testing of 3D printing materials.

Mechanical Testing of Additive Manufactured Components

A video discussing some of the most important considerations for testing additively manufactured, aka 3D printed, components.

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