The Challenge
Laminates are basic materials used to mechanically support electronic components and to interconnect them electrically. Copper clad laminates (CCL) are comprised of multiple layers of copper foils and reinforcing materials that are used between the foils. In the printed circuit board (PCB) manufacturing process, CCLs are used as a base material for electrical conductivity and physical performance, such as dimensional stability, punching quality, peel strength, bending strength, heat resistance, etc. As new reinforced materials (i.e. fiber-glass cloth, asbestos sheet, and paper) and different types of resins (i.e. phenolic, epoxy, and polyimide) are used, it is critical to perform mechanical testing under various conditions in order to understand the total strength of particular laminates. Reinforced materials used in combination with resins are designed to have excellent heat resistance, which prevents thermal stress on the PCB during the assembly process. Therefore, manufacturers are particularly interested in understanding the mechanical performance of CCLs in high temperature conditions, with the expectation of a similar performance under ambient conditions.
