Tensile testing of microelectronic components presents unique gripping challenges — specimens are often extremely small, fragile, and irregularly shaped, and incorrect gripping can damage the specimen, introduce misalignment, or produce inaccurate results. Instron's microelectronics tensile grip range is designed to address these challenges, offering precise, repeatable clamping for a wide range of components including leads, wires, thin films, single filaments, and asymmetrical assemblies. Force capacities range from 10 N to 10 kN across four grip types — pneumatic side action, screw side action, micro pneumatic, and pneumatic lead pull.
Pneumatic side action grips clamp the specimen through dual side action movement, actuated by an air cylinder built into the grip body. Gripping force can be controlled by adjusting the input air pressure and remains constant even if the specimen contracts in the gripped area — providing consistent follow-up action throughout the test. These grips are well suited to soft or delicate microelectronic specimens where consistent, adjustable clamping force is essential.
Available Grips
| Force Capacity | Catalog Number |
| 50 N | 2712-051 |
| 250 N | 2712-052 |
| 1 kN | 2712-041 |
| 2 kN | 2712-042 |
| 5 kN | 2712-045 |
| 10 kN | 2712-046 |
The 2710-100 Series dual-acting screw side action grips accommodate specimens up to 46 mm (1.8 in) thick and can be offset for irregular or asymmetrical specimens — including lap-shear and component testing configurations. The wide force capacity range makes these grips suitable for both delicate microelectronic components and higher-force assembly testing.
Available Grips
| Force Capacity | Maximum Jaw Face Opening With Serrated Jaw Faces | Catalog Number |
| 100 N | 35 mm | 2710-111 |
| 500 N | 35 mm | 2710-112 |
| 1 kN | 36 mm | 2710-113 |
| 2 kN | 36 mm | 2710-114 |
| 5 kN | 46 mm | 2710-115 |
| 10 kN | 46 mm | 2710-116 |
he micro pneumatic side action grips feature one fixed and one moving jaw face, actuated by a footswitch — freeing the operator's hands for accurate specimen placement. The large access area makes these grips particularly well suited to loading miniature specimens such as fine wires, thin films, and single filaments where precise positioning is critical. With a maximum specimen thickness of 0.8 mm and a 10 N force capacity, these grips are designed for the most delicate microelectronics tensile testing applications.
Specifications
| Force Capacity | Maximum Specimen Thickness | Catalog Number |
| 10 N | 0.8 mm | 2712-101 |
Wire Pull Hook Fixture
The wire pull hook fixture is designed for wire and wire bond pull testing on microelectronic components. The fixture meets the requirements of MIL-STD-883 method 2011.7 (bond strength - destructive bond pull test) and 2023.5 (non-destructive bond pull test).
Specifications
| Force Capacity | Catalog Number |
| 10 N | 2860-001 |
The pneumatic lead pull grip is a parallel action, pneumatically operated vice-action grip fitted with needle nose jaw faces — specifically designed for lead frame pull testing. The needle nose jaw faces enable precise gripping of fine-pitch leads without damaging adjacent components, and the parallel action ensures consistent, centered clamping force for accurate, repeatable pull test results.
Specifications
| Force Capacity | Catalog Number |
| 500 N | 2712-212 |
Instron's microelectronics tensile grips are compatible with the following testing systems:
Talk to an Instron Expert.
Not sure which grip is right for your microelectronics testing application? Our team can help you identify the right grip type, jaw face configuration, and force capacity for your specific components and test requirements.
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