กลับสู่เมนูหลัก
Home

Torsion Testing of Flexible Circuits and Microelectronic Components

Electronics » Microelectronics

Torsion Testing of Flexible Circuits and Microelectronic Components

IPC TM-650

The Challenge

Because the industry has trended towards the miniaturization of mobile electronic devices, flexible printed circuits (FPC) have become increasingly attractive to OEMs. In addition, the availability of flexible electronic displays allows these products to be flexible or bendable. As these technologies are still relatively new, it is critical to understand the mechanical reliability of these sub-assemblies. Understanding how torsion is applied to FPC panels is important when evaluating component layout patterns under various load conditions.

Our Solution

The Torsion Add-On 3.0 is capable of twisting FPC panels at various degrees of rotation, while pneumatic side action tensile grips can be used to hold FPC panels in the correct position for performing the twisting operations. Bluehill^® Universal software offers the ability to create test methods for automating the torsion operation, and for measuring critical results, such as force to break. Cyclic torsion testing can also be set up with Bluehill Universal.

Electronics » Microelectronics

Bend Testing of Printed Circuit Boards

AEC-Q200-005A | IPC TM-650 | ASTM F3147-15

The Challenge

Surface mounting and through-hole mounting of electronic packages, such as BGAs, QFNs, CSPs, etc. on a substrate can impact the mechanical reliability of finished printed circuit board (PCB) goods. With high-density component packaging and complex layouts, PCBs undergo mechanical and thermal stress from the assembly processes, leading to an increased risk of failures, such as warping, cracking, and failure in the joints between the die and the substrate. When electronic packages are mounted on both sides of a PCB, it is even more imperative to understand the mechanical reliability of a finished PCB. Furthermore, requirements driven by standards, such as the Automotive Electronics Council (AEC-Q200-005A) and IPC TM-650, require testing of finished PCBs to understand terminal failure of surface mounted components after they undergo bending, flexing, and pulling during the assembly process. Mechanical failure of these boards in finished products impact the electrical performance of devices where populated PCBs are used, presenting a risk to OEMs.

Our Solution

The Instron^® 6800 Series single column and dual column table model systems are designed to conduct bend testing at various force capacities. Additionally, the 2810-400 Series of flex fixtures can be outfitted with various anvil radii. Micro 3-point and 4-point bend fixtures are available for miniaturized PCBs. Bluehill^® Universal software offers a wide range of calculations to estimate bending stress, flexural strength, and maximum force.

3400 Series Universal Testing Systems

Die Shear Testing of Electronic Packages

Electronics » Microelectronics

Die Shear Testing of Electronic Packages

IPC TM-650 | MIL-STD-883E | AEC-Q200-006A | ASTM F1269-13

The Challenge

Die shear testing is an important step when investigating the mechanical reliability of conductive adhesives that are used between the die and substrate. When designing modern surface mount assemblies, manufacturers are constantly formulating novel isotropic conductive adhesives that can improve the shear strength over traditional adhesives. Additionally, experts are interested in understanding the failure analysis post-shearing of the die. As the high density packaging and component miniaturization trends continue to grow, electronic packages are getting smaller and thinner in size. As a result, it is critical to understand the mechanical performance of these components.

Our Solution

Die shear testing can be performed on a 6800 Series single or dual column system with Instron’s Terminal Strength Shear Fixture (CP122690), which was designed by our Custom Solutions Group and is used to hold a sample populated printed circuit board (PCB) and shear target components. The fixture consists of an adjustable PCB holder that can accommodate a variety of board sizes and a linear rail, allowing the operator to center the probe on the component of interest. A variety of probes can be utilized to test components of different sizes. Bluehill^® Universal software can be used to create test methods, and results such as maximum force can be measured. For a visual representation of die shearing, TestCam is offered to capture real time video with Bluehill Universal.

3400 Series Universal Testing Systems

Compression Testing of IC Packages

Electronics » Microelectronics

Compression Testing of IC Packages

The Challenge

Three closely related trends in the microelectronics industry are: complex printed circuit board (PCB) layouts, dimensional reduction of PCB packages, and high density packaging. The assembly of electronic packages, integrated circuits (ICs), and other components on PCBs introduce mechanical stress. High density packaging of components on both the top and bottom side of a PCB creates an increased probability of mechanical failures, such as cracks or fractures. Furthermore, OEMs are interested in knowing how the application of force changes voltage or current generated from the chips, as materials used to manufacture these chips and their forms constantly evolve over time.

Our Solution

Instron^® 6800 Series single and dual column systems, along with an Automated XY Stage, are configured to perform micro-compression tests across multiple points of a chip or component. Fixtures developed by our Custom Solutions Group can clamp these components at proper positions to conduct the test accurately. Since micro-compression tests involve measuring displacement or deflection in microns, routines can be performed to eliminate any system compliance or variance from the machine, load cell, and the fixture. Different style probes are available and can be developed to perform point-based compression testing.

Micro-compression platens are available to conduct compression of the entire package or chip simultaneously. External measurement devices, such as the LVDT Platen Displacement Fixture, can be used to perform contact style measurement, and the Advanced Video Extensometer 2 (AVE 2) can be used to perform non-contact style deflection measurement in microns. Instron’s Bluehill^® software is used to set up test methods for an XY stage or micro-compression platens. Using external strain channels, graphical results on voltage and resistance to corresponding force can be presented in the software.

3400 Series Universal Testing Systems

Solder Ball Compression Test

Electronics » Microelectronics

Solder Ball Compression Test

IPC TM-650

The Challenge

Solder paste manufacturers and electronics packaging experts are constantly formulating new compositions of solder alloys and flux materials to address assembly challenges. Type 6 solder powder, with a particle size of 10 µm and below, is preferred over type 4 and type 5 solder pastes for the assembly of 0201s chip components. Ball grid array packages (BGA) that are attached on the substrate using solder bumps on the bottom of the package are trending towards smaller size solder bumps. As a result, it is important to perform mechanical testing on the solder bumps, or solder balls, in order to understand the maximum load sustainable before failure. One effective way to test these solder balls is through compression. By applying a compressive load to a single solder ball, maximum force can be estimated before the ball cracks to failure. This helps in characterizing the bump strength of solder for package assemblies.

Our Solution

The Instron^® 6800 Series systems are ideal for conducting this micro-precision compression test. Depending on the force required to break, either a single or a dual column system can be used. Custom pin type probes of various dimensions are available to perform accurate compression tests on the solder ball. A multitude of clamping solutions are offered for accurate clamping and positioning of package assemblies for conducting this test. Instron’s Automated XY Stage Testing Systems offer an automated solution for performing compression tests on multiple solder balls in a single test run. The TestCam module in Bluehill^® Universal software can be used for real-time live feedback of the compression test, allowing for a visual review of the bump compression for qualitative analysis. In cases where you need to introduce a high temperature before performing the test, custom heating stages are available, allowing you to heat the package or the substrate prior to compression.

3400 Series Universal Testing Systems

Stud Pull Test for Electronic Packages

Electronics » Microelectronics

Stud Pull Test for Electronic Packages

The Challenge

A typical surface mount assembly involves mounting electronic packages onto the printed circuit board (PCB). This assembly requires bonding of a chip or die onto the PCB using solder paste and other adhesive materials. For example, the assembly of flip chips, ball grid arrays (BGA), and chip-scale packages (CSP) require you to apply the process of underfill for the bonding between the die and the substrate. As part of the design and mechanical validation, OEMs look to perform tests that measure the bond strength of the adhesives in a package assembly at various operating conditions. One such critical technique is the stud pull test for packages of various dimensions.

Our Solution

Instron® offers an easy to use stud pull fixture with a specimen preparation fixture for running the test at ambient and high temperatures. The specimen preparation fixture allows the operator to bond the studs on the die package using a high strength adhesive. The fixture applies a constant force, enabling correct alignment, which is highly critical to the test. In addition to the preparation fixture, the stud pull fixture has upper and lower fittings with self-aligning swivels at both sections. This allows for accurate alignment of the studs in parallel to the frame, or perpendicular to the cross-head. High temperature chambers are also offered to perform this test. Stud sets are designed in various sizes, ranging from 2 mm to 50 mm, to fit a range of die package dimensions.

Electronics » Microelectronics

Bend Test of Electronic Packages

SEMI G69-0996 | ASTM D790 | ASTM D6272 | IPC TM-650 | JEDEC 9702 | MIL STD 883 | SEMI G86-0303

The Challenge

Understanding the mechanical reliability of microelectronic components and packages is a critical step towards design validation. With high density packaging, components are getting smaller and thinner so they can be used on the printed circuit boards (PCBs) of hand-held devices. Furthermore, new materials are being introduced, such as the addition of layers on electronic packages, which requires validation of the material’s strength. During new product development, OEMs are required to know the mechanical stress induced on various electronic packages, as they are subjected to warping from the assembly process of PCBs on the top and bottom of the substrate. New innovations in electronic packages, such as chip-on-film, stacked multi-layered packages, etc. require a thorough understanding of mechanical failure.

Our Solution

The Instron^® micro bend fixtures are designed to perform bend testing on small scaled electronic packages, and other microelectronic components. The micro 3-point and 4-point bend fixtures are used to apply stress at local regions, or throughout the package. Using these fixtures, users can determine the load at which the packages undergo failure, such as cracking, delamination of layers, fatigue, etc. Bend fixtures are available with various anvil radii based on package dimensions. Variable span adjustments on the lower anvil are available using a micrometer screw gauge to precisely set the span length. Bluehill^® Universal software can be used to easily set up test methods and to perform the bend tests on different sized components. In cases where flexure displacement is a required measurement, a compliance correction routine can be performed to eliminate any system compliance that can affect the results.

Electronics » Microelectronics

Tensile Testing of Copper Clad Laminates (CCL)

IPC TM-650 | ASTM D5109-12

The Challenge

Laminates are basic materials used to mechanically support electronic components and to interconnect them electrically. Copper clad laminates (CCL) are comprised of multiple layers of copper foils and reinforcing materials that are used between the foils. In the printed circuit board (PCB) manufacturing process, CCLs are used as a base material for electrical conductivity and physical performance, such as dimensional stability, punching quality, peel strength, bending strength, heat resistance, etc. As new reinforced materials (i.e. fiber-glass cloth, asbestos sheet, and paper) and different types of resins (i.e. phenolic, epoxy, and polyimide) are used, it is critical to perform mechanical testing under various conditions in order to understand the total strength of particular laminates. Reinforced materials used in combination with resins are designed to have excellent heat resistance, which prevents thermal stress on the PCB during the assembly process. Therefore, manufacturers are particularly interested in understanding the mechanical performance of CCLs in high temperature conditions, with the expectation of a similar performance under ambient conditions.

Our Solution

Instron^® 6800 Series single column and dual column systems can perform tensile tests on CCL materials, and can be equipped with a set of grips to fit the dimensions of the CCL being tested. When performing strain measurements, contact and non-contact style strain devices are available. The 2630 Series and W-6820 Series axial clip-on extensometers are simple contact-style strain measurement devices. Non-contact video extensometers, such as the Advanced Video Extensometer 2 (AVE 2), are more advanced and offer higher accuracy for strain measurement.

To perform tensile tests at non-ambient temperatures, the 3119-600 Series environmental chambers are capable of achieving temperatures that can range from -150O C to +350O C. For high temperature conditions, corresponding grips and contact-style extensometers are also available.

Bluehill^® Universal software offers the ability to easily set up test methods and run tests at various environmental conditions. Results such as strain and tensile strength can be calculated from the software. The QuickTest feature allows the user to set up and quickly run a tensile test in order to understand preliminary results of CCL materials.

3400 Series Universal Testing Systems

Lead Frame and Wire Bond Pull Test

Electronics » Microelectronics

Lead Frame and Wire Bond Pull Test

IPC TM-650 | ASTM F459-13

The Challenge

Lead frames used in various electronic packages, such as capacitors, resistors, and integrated circuits (IC), are used to provide electrical interconnection between the die and the substrate. Some components may have one or two leads, while other packages such as IC chips can have hundreds. These lead frames are bonded using solder paste materials. As part of reliability testing, it is critical to test the bond strength of the lead at the solder joint, allowing you to better understand where failure occurs. Tensile testing can reveal the benefits of using various materials, such as gold, copper, etc., when developing new lead frames and final assemblies. Some of the most common challenges in tensile testing of lead frames include accurate gripping, alignment of the package or components, gripping of printed circuit boards (PCBs), and determining the failure location with real-time data.

Our Solution

Instron^® micro pneumatic grips are designed to hold the lead frames in an accurate position for the pull test. Other grips, such as wire pull hooks, are also available to align and hold the lead frame accurately. XY stages are designed to accurately mount and position any rigid or flexible printed circuit boards. These stages allow you to adjust the X and Y axis using a micrometer, as well as the angular position, theta, to enable easier gripping of micro components with a fine pitch assembly. The XY stages are available in a manual version, or you can fully automate the lead pull test with the motorized version, ensuring high accuracy and repeatability. The TestCam module for Bluehill^® Universal is designed to shoot high-frame rate videos while tests are being conducted. The camera can be synced with the software to observe images and videos at various test points in real-time. Bluehill Universal software is designed for the user to add calculations and to plot various response curves, such as force vs. displacement and stress vs. strain, that are relevant to the application. In the lead tensile test, the software can be used to plot the force vs. displacement curve in order to identify the maximum load needed to break the lead frame from the solder joint.

ลิงค์ที่เป็นประโยชน์

ติดตามเรา

สมัครสมาชิก

เข้าร่วมจดหมายข่าวของเราเพื่อติดตามข่าวสารล่าสุดเกี่ยวกับคุณสมบัติและการเผยแพร่

การคลิกส่งถือเป็นการยืนยันว่าคุณเห็นด้วยกับข้อกำหนดและเงื่อนไขของเรา