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June 9, 2026

Semiconductor Testing in the Age of AI

Semiconductor Testing in the Age of AI

As AI pushes semiconductor design into 3D packaging, new materials, and co-packaged optics, testing must evolve.

April 17, 2026

How Do Drop Towers Improve Tensile Strength Impact Testing?

How Do Drop Towers Improve Tensile Strength Impact Testing?

Drop tower tensile impact testing gives insight into how materials behave under high-speed loading conditions.

August 22, 2025

How to Connect Transducers to Instron Systems: Four Methods

How to Connect Transducers to Instron Systems: Four Methods

Integrating third-party sensors and transducers into an Instron testing system — whether for force, strain, temperature, pressure, or displacement — requires choosing the right connection method for your setup. This article covers the four supported approaches: analog 0–10V input, rationalized connection with self-identification and auto-calibration in Bluehill Universal, custom polynomial calibration for non-Instron transducers, and digital data input via third-party equipment such as the HBM QuantumX MX430B.

September 2, 2022

How to Achieve More Repeatable Test Results in 3D Printing Applications

How to Achieve More Repeatable Test Results in 3D Printing Applications

Learn how new standards combined with the latest HDT Vicat tester technology can help achieve more repeatable testing of 3D printing materials.

January 21, 2022

Mechanical Testing of Additive Manufactured Components

Mechanical Testing of Additive Manufactured Components

A video discussing some of the most important considerations for testing additively manufactured, aka 3D printed, components.

January 21, 2015

Is This the Next Generation of Smartphone Cases?

Is This the Next Generation of Smartphone Cases?

Is This the Next Generation of Smartphone Cases? In ASM International’s recent article, the publication discusses an exciting development happening at Yale University. The team researching mechanical engineering and materials […]

August 7, 2014

Consumer Reports Uses Instron for Bend Testing Smartphone

Consumer Reports Uses Instron for Bend Testing Smartphone

Consumer Reports Uses Instron for Bend Testing Smartphone Consumer Reports sought to test LG’s G Flex smartphone, which claims to bend to life’s curves. The material properties of rigid plastic, […]

January 27, 2012

Protecting Mobile Devices from Impact Damage

Protecting Mobile Devices from Impact Damage

Protecting Mobile Devices from Impact Damage Denise Czerpak I find it difficult to walk down the street, or in the mall, without having to move out of the way to […]