Lap Shear Testing of Electronic Adhesives
Manufacturers of electronic adhesives need to characterize the materials used in surface mount assemblies of microelectronic components. As OEMs rapidly change their electronics packaging designs, new adhesives are formulated to keep pace, and measuring bond strength is one of the essential metrics for comparing different formulations.
A lap shear test is a recognized method for simulating real-life loading conditions. The test uses two overlapping specimens bonded together, then applies tensile force until the bond fails in shear. Industry organizations such as the International Electronics Manufacturing Initiative (iNEMI) offer recommendations for performing lap shear tests to characterize solder alloys, such as the tin-silver-copper (SAC) alloys used in solder paste.
Recommended Testing Solutions
6800 Series Universal Testing Systems are available in single- and dual-column configurations to match your load capacity requirements. A range of gripping solutions, such as mechanical wedge action grips and pneumatic side action grips, is available to align and hold the specimen securely in position.
Bluehill® Universal Software is used to create lap shear test methods and to measure the maximum force required to shear the bonded specimens. For qualitative analysis, the TestCam module records video of each test, so you can review exactly how the bond behaved under load.
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